Google Pixel 9 Series to launch with Tensor G4 chipset, which is thermally efficient: Report

 

Based in California Google is getting ready for the August 13 launch of the Pixel 9 series, its flagship smartphone portfolio. Recent leaks, which have focused mostly on the Tensor G4 chipset, have revealed details about the future devices' performance and specs. The new chipset promises improved efficiency but may not result in considerable power gains.

Details about the Google Pixel 9 Chipset

The Tensor G4 chipset in the Pixel 9 series will have eight cores arranged in a 4+3+1 configuration, according to Android Authority. Four Cortex-A520 efficiency cores, three Cortex-A720 mid cores, and one Cortex-X4 primary core make up this arrangement. The Tensor G3, on the other hand, had a 4+4+1 nine-core configuration. It is believed that this improvement will improve thermal efficiency.

A DS

The ARMv9.2 cores in the new chipset will operate at faster clock speeds than those in the previous model. It is anticipated that performance increases will be minimal despite the increased speeds. According to Geekbench scores, the Pixel 9 Pro XL outperforms the Pixel 8 Pro by achieving an 11% improvement in single-core performance and a 3% increase in multi-core performance. In particular, the Pixel 9 Pro XL scored 1950 in single-core tests as opposed to 1761 for the Pixel 8 Pro, and 4655 in multi-core tests as opposed to 4523 for the Pixel 8 Pro.

Improvements to the Modem and Connectivity

According to a previous April report (via Gadegts 360), the Exynos Modem 5400 from Samsung's LSI division will be included in the Pixel 9 series. This new modem is anticipated to be up to 50% more power-efficient than the modem found in the Pixel 8 and will include satellite connection. This update may greatly extend the Pixel 9 series' battery life and fix earlier efficiency problems linked to outdated modems.

With the launch date drawing near, these leaks paint a more accurate picture of what to anticipate from the Pixel 9 series, emphasizing connection and efficiency enhancements over pure performance increases.

A DS